賀利氏電子中國(guó)區(qū)研發(fā)Condura.ultraTM無銀AMB氮化硅基板---車規(guī)級(jí)功率模塊用高性價(jià)比解決方案Condura.ultraTM silver free AMB --- cost-effective solution for automotive power module張靖賀利氏電子中國(guó)區(qū)研發(fā)總監(jiān)ZHANG JingDirector of Innovation China, Heraeus Electronics
56500
