面向Micro-LED封裝的先進半導體鍵合集成技術Advanced Semiconductor Bonding Technology for Micro-LED Integration母鳳文北京青禾晶元半導體科技有限責任公司董事長兼總經理MU FengwenPresident and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.
CSP芯片級封裝在Mini-LED背光中的應用進展The Progress of Chip Scale Package in Mini-LED TV Backlighting劉國旭北京易美新創科技有限公司CTO、執行副總裁Jay Guoxu LIUCTOExecutive VP of ShineOn Innovation Technology Co., Ltd
面向的Ga2O3功率器件應用：封裝、魯棒性和多維器件Ga2O3Power Device Toward Application: Packaging, Robustness, and Multidimensional Devices張宇昊弗吉尼亞理工大學電力電子中心副教授ZHAGN YuhaoAssociate Professor of Center for Power Electronics Systems at Virginia Tech
教育用封裝光源顏色參數漂移及熱特性分析研究Analysis and research on color parameter drift and thermal properties of packaged light source applied in education王書昶常熟理工學院副教授WANG ShuchangAssociate Professor of Changshu Institute of Technology
GaAs VCSEL 先進封裝技術進展及應用Progress of Advanced Packaging Techniques for GaAs-based VCSELs and Its Applications林勝寧波升譜光電股份有限公司副總經理LIN ShengDeputy General Manager of NINGBO SUNPU LED CO.,LTD.
耐高溫無機膠及白光/深紫外LED封裝研究Enhanced heat dissipation of high-power WLEDs through creation of 3D dams on ceramic substrate with geopolymer/graphene paste孫慶磊中國地質大學（武漢）先進制造中心副教授SUN QingleiAssociate Professor of Advanced Manufacturing Center of China University of Geosciences (Wuhan)
耐高能量密度照明及健康照明封裝發展機遇及挑戰Development opportunities and challenges of high energy density lighting and health lighting packaging陳磊旭宇光電（深圳）股份有限公司研發總監、清華大學博士后CHEN LeiRD Director of XUYU OPTOELECTRonICS(SHENZHEN) CO., LTD.
集成反射器的封裝技術用于提升高功率UVC LED芯片的光提取效率Enhanced Light Extraction Efficiency of high power UVC LEDs by SMD-Packaging with Integrated Reflectors胡曉東德國MSG Lithoglas GmbH亞太地區總監HU XiaodongDirector of Asia Pacific Region of MSG Lithoglas GmbH, Germany
背光模組中Mini LED對封裝材料的要求與挑戰Requirements and Challenges for Packaging Materials for Mini LEDs used in Backlight Modules徐建軍北京康美特科技股份有限公司首席技術官Jianjun XUCTO of Beijing KMT Technology Co., Ltd.
先進封裝大板扇出研發及功率器件封裝應用The Research on Panel Level Fan Out Package and its Application on Power Electronics林挺宇廣東佛智芯微電子技術研究有限公司副總經理，廣東省半導體智能裝備與系統集成創新中心首席科學家Tingyu LINDeputy General Manager of Guangdong FZX Microelectronics Technology Co. Ltd, Principal Scientist of CNC Equipment Cooperative Innovation Institute
美國智能照明工程技術研究中心主任, 美國倫斯勒理工學院教授Robert F. KARLICEK做了題為 LED和LED封裝的未來趨勢的主題報告，探討了一些可能性，包括未來的城市照明需求、照明和視頻的融合可能性、以及其他LED照明系統在未來的應用。 Robert F. KARLICEK教授有超過25年與產業領頭人（包括ATT Bell Labs、EMCORE、通用電氣、Gore Photonics和Microsemi）合作進行光電器件的研究、研發、和制造的經驗。他的主要研究重點是開發了固態
