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高功率寬禁帶半導體射頻器件研究進展Research Progress of High Power Wide Band-gap Semiconductor RF Devices張進成西安電子科技大學副校長、教授ZHANG JinchengVice PresidentProfessor of Xidian University

實現超小型全氮化微型LED的納米級材料科學Nanometer-scale Materials Science Enabling Ultra-small All-Nitride Micro-LEDsLarsSAMUELSON瑞典皇家科學院及工程院兩院院士、中國科學院外籍院士、瑞典德隆大學教授、南方科技大學講席教授LarsSamuelsonMember of Royal Swedish Academy of Engineering, Member of Royal Swedish Academy of Sciences，Foreign Member of the Chinese Academy of Sciences, Professor of Lund Univer

融通半導體產業鏈 構建應用創新生態圈Integrate Semiconductor Industry Chain to Build Application Innovation Ecosystem李虹華潤微電子有限公司總裁LI HongPresident of China Resources Microelectronics Limited

最新高性能SiC MOSFET技術助力未來SiC市場的發展趨勢The Latest High Performance SiC MOSFET Technology Trend for Future SiC Market Development濱田公守日本華為股份有限公司高級首席專家Kimimori HAMADASenior Chief Expert Huawei Technologies Japan

基于大失配外延的氮化物第三代半導體材料與器件Nitride Semiconductor Materials and Devices Based on Large Mismatch Epitaxy沈波北京大學理學部副主任、特聘教授SHEN Bo Deputy Deanand Distinguished Professorof Facultyof Science, Peking University

用于病毒滅活的藍寶石生長230nm遠紫外光功率模組的開發研究Development of 230 nm Far-UVC LED Power Module Grown on c-Sapphire for Human Harmless Virus Inactivation平山秀樹日本理化研究所平山量子光素子研究室主任Hideki HIRAYAMAProfessor ofRIkagaku KENkyusho Institute of Physical and Chemical Research(RIKEN),Japan

加快碳化硅芯片和電力電子器件的商業化發展Accelerating Commercialization of SiC Chips and Power ElectronicsVictor VELIADIS美國PowerAmerica執行董事兼CTO、ICSCRM 2024 大會主席、北卡羅萊納州立大學教授、IEEE寬禁帶功率半導體技術路線圖委員會(ITRW)主席Victor VELIADISExecutiveDirector and CTO of PowerAmerica, Chair of ICSCRM 2024, Professor of North Carolina State Universityand Chair of ITRW ( IEEE Wide Ban

2024中國第三代半導體技術十大進展/ 2024 China's Top 10 Advances in Wide Band-gap Semiconductor Technology

半導體材料產業的現狀和挑戰Status and Challenge of Semiconductor Material Industry楊德仁中國科學院院士、浙大寧波理工學院校長、浙江大學硅及先進半導體材料全國重點實驗室主任、教授YANG DerenAcademician of Chinese Academy of Sciences,President of NingboTech University, Professor and Director of State Key Laboratory of Silicon and Advanced Semiconductor Materials, Zhejiang University

基于量子點光刻技術的 0.18cc全彩Micro-LED光機0.18cc Full-color Micro-LED Light Engine Powered by QDPR Technology莊永漳鐳昱光電科技(蘇州)有限公司創始人兼CEOEddie CHONGFounderCEO of Raysolve Optoelectronics (Suzhou) Company Limited.

從芯到屏，垂直整合開啟Micro-LED智慧顯示時代From Chip to Screen, Vertical Integration - Open the Era of Micro-LED Smart Display席光義元旭半導體科技股份有限公司董事會主席兼CEOXI GuangyiChairman and CEO of Novoshine

面向Micro-LED封裝的先進半導體鍵合集成技術Advanced Semiconductor Bonding Technology for Micro-LED Integration母鳳文北京青禾晶元半導體科技有限責任公司董事長兼總經理MU FengwenPresident and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.

臺灣錼創科技副總經理呂志強：MicroLED的量產策略

基于納米壓印全生態產業平臺的微納光學器件制造Manufacturing of Micro and Nano Optical Devices Based on Nanoimprint Eco-industrial Platform羅剛材料科學姑蘇實驗室研究員、蘇州新維度微納科技有限公司創始人LUO GangProfessor of Gusu Lab, Founderof NDnano

CSP芯片級封裝在Mini-LED背光中的應用進展The Progress of Chip Scale Package in Mini-LED TV Backlighting劉國旭北京易美新創科技有限公司CTO、執行副總裁Jay Guoxu LIUCTOExecutive VP of ShineOn Innovation Technology Co., Ltd

探索多元Mini-LED顯示技術進階之路Explore the Advanced Road Multiple Mini-LED Display Technology 劉傳標廣州市鴻利顯示電子有限公司總經理LIU ChuanbiaoGeneral Manager of Hongli-gx Light

基于混合鍵合的無損Micro-LED芯片技術Damage-free Micro-LED Based on Hybrid Bonding Technology 蔣振宇蘇州秋水半導體科技有限公司董事長JIANG ZhenyuPresidentof Suzhou QiuShui Semiconductor Technology Inc.

顯示用Micro-LED芯片與集成技術新進展New Progress of Micro-LED Chip and Integration Technology for Display黃凱廈門大學物理科學與技術學院副院長、教授HUANG KaiDeputy DeanProfessor of College of Physical Science and Technology, Xiamen University

玻璃基TFT Micro-LED拼接屏的機遇和挑戰Opportunities and Challenges of TFT Micro-LED Display曹軒成都辰顯光電有限公司副總經理Carl CAOVice General ManagerCTO of Chengdu Vistar Optoelectronics Co., Ltd.

面向SiC功率器件的裝備與工藝解決方案NAURA Solutions for SiC Power Devices張軼銘北京北方華創微電子裝備有限公司Zhang YimingBeijing NAURA Microelectronics Equipment Co.,Ltd